| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| K3QF3F30BM-FGCF | 存储IC |
SAMSUNG/三星 |
BGA |
15+ |
16 |
|||
| K3RG2G20BM-MGCJ | 其他被动元件 |
SAMSUNG/三星 |
BGA |
15+ |
3000 |
|||
| K3QF1F10DM-AGCE | 存储IC |
SAMSUNG/三星 |
BGA |
15+ |
52 |
|||
| SDIN5C2-4G | 内存芯片 |
SANDISK |
BGA |
14+ |
350 |
|||
| K3QF4F40BM-FGCF | 存储IC |
SAMSUNG/三星 |
BGA |
17+ |
5478 |
|||
| K3PE7E700D-XGC2 | 内存芯片 |
SAMSUNG/三星 |
BGA |
13+ |
329 |
|||
| KLUDG8V1EE-B0C1 |
|
存储IC |
SAMSUNG/三星 |
BGA |
19+ |
6000 |
||
| KMRX100BM-B614 | 内存芯片 |
SAMSUNG/三星 |
BGA |
17+ |
2 |
|||
| ACMD-6107-TR1 | 内存芯片 |
AVAGO/安华高 |
QFN |
15+ |
44369 |
|||
| K3QFBFB0CM-FGCF |
|
内存芯片 |
SAMSUNG/三星 |
BGA |
16+ |
3000 |
||
| MSM-8974-9-990BPNSP-TR-01-0-AA | 其他被动元件 |
QUALCOMM/高通 |
BGA |
15+ |
2598 |
|||
| KLMCG4JENB-B041 | 存储IC |
SAMSUNG/三星 |
BGA |
16+ |
939 |
|||
| MT52L256M64D2PD-107 WT:B | 存储IC |
MICRON/美光 |
BGA |
16+ |
800 |
|||
| SKY77358-11 | 其他被动元件 |
SKYWORKS/思佳讯 |
QFN |
15+ |
8634 |
|||
| WCN3680 | 其他被动元件 |
QUALCOMM/高通 |
BGA |
15+ |
7972 |
|||
| PM8921 | 其他被动元件 |
QUALCOMM/高通 |
BGA |
14+ |
2000 |
|||
| SR528 | 内存芯片 |
SPREADTRU |
QFN |
11+ |
1119 |
|||
| SDINADF4-64G | 存储IC |
SANDISK |
BGA |
16+ |
6309 |
|||
| DB8520 | 内存芯片 |
ST/意法 |
BGA |
12+ |
576 |
|||
| KMN5X000ZM-B209 | 内存芯片 |
SAMSUNG/三星 |
BGA |
14+ |
377 |
|||
| MT29C8G96MAAFAPCKD-5 IT | 内存芯片 |
MICRON/美光 |
BGA |
11+ |
1032 |
|||
| PM8004 |
|
其他被动元件 |
QUALCOMM/高通 |
BGA |
16+ |
80000 |
||
| MT29C1G12MAADYAMD-5IT | 内存芯片 |
MICRON/美光 |
BGA |
14+ |
873 |
|||
| THGBMAG8A4JBA4R | 存储IC |
TOSHIBA/东芝 |
BGA |
17+ |
150 |
|||
| SDIN2B2-8G | 内存芯片 |
SANDISK |
BGA |
106 |
||||
| SKY77518-11A | 直插晶振 |
SKYWORKS/思佳讯 |
QFN |
11+ |
4000 |
|||
| THGBMHG8C4LBAW7 | 内存芯片 |
TOSHIBA/东芝 |
BGA |
1751+ |
8000 |
|||
| KLUBG4G1CE-B0B1 | 存储IC |
SAMSUNG/三星 |
BGA |
17+ |
4480 |
|||
| KLUEG8UHDB-C2D1 | 内存芯片 |
SAMSUNG/三星 |
BGA |
19+ |
800 |
|||
| KLUFG8R1EM-B0C1 | 存储IC |
SAMSUNG/三星 |
BGA |
18+ |
3700 |