| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| ACPM-2302-TR1 | 其他被动元件 |
AVAGO/安华高 |
BGA |
14+ |
4000 |
|||
| JW796 | 内存芯片 |
MICRON/美光 |
BGA |
13+ |
763 |
|||
| THGBMHG8C2LBAIL | 存储IC |
TOSHIBA/东芝 |
BGA |
17+ |
280 |
|||
| MSM-8952-0-821NSP-TR-01-0-AB |
|
其他被动元件 |
QUALCOMM/高通 |
BGA |
16+ |
321 |
||
| SKY85812-11 |
|
其他被动元件 |
SKYWORKS/思佳讯 |
SMD |
18+ |
5992 |
||
| K3QFBFB0CM-FGCF |
|
内存芯片 |
SAMSUNG/三星 |
BGA |
17+ |
35 |
||
| PMB5712A1 | 其他被动元件 |
INTEL/英特尔 |
BGA |
12+ |
3500 |
|||
| TY9A0A111361KA | 内存芯片 |
TOSHIBA/东芝 |
BGA |
11+ |
627 |
|||
| SDIN5C1-16G | 内存芯片 |
SANDISK |
BGA |
11+ |
19 |
|||
| QFE1040 | 其他被动元件 |
QUALCOMM/高通 |
BGA |
15+ |
4000 |
|||
| PM-8004-0-63BWLNSP-TR-00-0 |
|
工控元件 |
QUALCOMM/高通 |
BGA |
17+ |
12000 |
||
| SKY7703-2 | 内存芯片 |
SKYWORKS/思佳讯 |
QFN |
10+ |
3754 |
|||
| WCN-3680B-0-79BWLNSP-TR-05-1 |
|
其他被动元件 |
QUALCOMM/高通 |
BGA |
16+ |
1000 |
||
| K3UH6H60AM-NGCJ |
|
存储IC |
SAMSUNG/三星 |
BGA |
17+ |
5600 |
||
| HFQRX4WJB-296 |
|
其他被动元件 |
MURATA/村田 |
ModuleDiversityLNAFE |
16+ |
4000 |
||
| KMFNX0012M-B214 | 存储IC |
SAMSUNG/三星 |
BGA |
17+ |
200 |
|||
| MSM8960 | 内存芯片 |
QUALCOMM/高通 |
BGA |
13+ |
52 |
|||
| PF38F3050M0Y0CE | 其他被动元件 |
INTEL/英特尔 |
BGA |
12+ |
420 |
|||
| KMQ310013-B419 | 内存芯片 |
SAMSUNG/三星 |
BGA |
16+ |
769 |
|||
| MT29C2G24MAAAKAMD-5 | 内存芯片 |
MICRON/美光 |
BGA |
16+ |
3134 |
|||
| K4H510838J-BCB3 | 内存芯片 |
SAMSUNG/三星 |
BGA |
12+ |
16 |
|||
| QFE-1100-0-28BWLNSP-TR-03-1 | 其他被动元件 |
QUALCOMM/高通 |
BGA |
16+ |
3506 |
|||
| QFE-1040-0-40WLPSP-TR-07-0 | 其他被动元件 |
QUALCOMM/高通 |
BGA |
15+ |
4000 |
|||
| KMQ310013M-B419 | 内存芯片 |
SAMSUNG/三星 |
BGA |
16+ |
769 |
|||
| SDADL2BP-32G |
|
存储IC |
SANDISK |
BGA |
17+ |
150 |
||
| KMGX6001BM-B514 | 存储IC |
SAMSUNG/三星 |
BGA |
18+ |
161 |
|||
| KMRX1000BM-B614 | 内存芯片 |
SAMSUNG/三星 |
BGA |
17+ |
360 |
|||
| SDIN5C1-16G | 内存芯片 |
SANDISK |
BGA |
12+ |
35 |
|||
| PM8004 |
|
其他被动元件 |
QUALCOMM/高通 |
BGA |
17+ |
12000 |
||
| K4E6E304ED-AGCC | 内存芯片 |
SAMSUNG/三星 |
BGA |
14+ |
197 |